Course Description
SCP004 - Wet/Dry Etch Process Overview - 8.00 Hours
Prerequisites
Semiconductor Processing Overview Course offered through TEEX or course equivalent.
Description
This course is designed for the Semiconductor Processing Industry to provide professional development for a broad audience of employees working for semiconductor manufacturers and suppliers. It is one of a series of overview courses developed to cover process issues for each major semiconductor processing step. This particular course stresses the fundamentals of current processes used in wet/dry etch. While the course is technical in nature it does not focus on specific process related information. It provides a broad overview of the wet/dry etch process and the general principles that are involved. The course also assists participants in understanding in general terms the potential relationship of wet/dry etch to the upstream and downstream processes in the Semiconductor Industry.
Topics
- Introduction to semiconductor processing steps
- Introduction to etching and it's purpose
- Introduction to the two types of etching and their uses
- Wet etching processes
- Dry (plasma) etching processes
- Dry etch of silicon processes
- Dry etch of metals and silicides
- Photoresist ashing
Audience
All skill levels having an interest in an introduction to the wet/dry etch process and those who require a broad overview of the specific process. This course would assist support staff, equipment operators, entry-level technicians, process and equipment maintenance technicians, entry-level engineers and new hire professional staff in understanding the wet/dry etch process.
Other Information
To have this class taught on site please call customer service at 1-800-541-7149 for more information or email us at ted@teexmail.tamu.edu